U.S. Commerce Department to Grant $75 Million to Absolics for Semiconductor Facility in Georgia

The US Commerce Department has announced plans to grant $75 million to Absolics for the construction of a new facility in Georgia that will supply advanced materials to the semiconductor industry. This move is part of the U.S. government’s $52.7 billion semiconductor chips manufacturing and subsidy fund, aimed at boosting domestic semiconductor production.

Absolics, a semiconductor packaging provider and affiliate of SKC Co, is set to build a 120,000-square-foot facility in Covington, Georgia. The funds will be used to develop technology for advanced packaging, making it the first commercial facility to support the semiconductor supply chain with new advanced materials. This project is expected to create 1,000 construction jobs and 200 manufacturing and R&D jobs in the area.

CEO Jun Rok Oh expressed excitement over the funding, stating that it will enable the company to fully commercialize their innovative glass substrate technology for high-performance computing and defense applications. Absolics’ glass substrate allows for processing and memory chips to be packed into a single device, improving computing efficiency.

This investment is part of a larger effort by the U.S. government to strengthen the semiconductor industry in the country. Commerce Secretary Gina Raimondo has made advanced packaging a priority, aiming to reduce the reliance on Asian markets for these critical components. Other major players in the semiconductor industry, such as SK Hynix, Intel, TSMC, Samsung, and Micron Technology, have also received significant grants as part of this initiative.

The collaboration between Absolics, the U.S. government, and other industry leaders underscores the importance of advancing domestic semiconductor production and innovation. This project represents a significant step towards enhancing the competitiveness of the U.S. semiconductor industry on the global stage.