Tuesday, May 28, 2024

Chinese Consortium Advances in Developing HBM, Aims for HBM2 Production by 2026, News Report Reveals

Developments in Chinese Chip Industry: HBM Semiconductors and AI Chipsets

In a groundbreaking development in the semiconductor industry, two major Chinese chip manufacturers are paving the way for producing High Bandwidth Memory (HBM) semiconductors, with a primary focus on AI chipsets. Despite facing export restrictions from the United States, China is making significant progress, especially on older versions of HBM, in a bid to reduce reliance on global suppliers.

According to a report from Reuters, China’s largest DRAM chip manufacturer, ChangXin Memory Technologies (CXMT), is collaborating with chip packaging and testing company Tongfu Microelectronics to develop HBM chip samples. These samples are currently being showcased to potential customers, indicating a significant step forward in China’s semiconductor industry.

Additionally, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC) is in the process of constructing a 12-inch plant with a monthly capacity of 3,000 wafers, planned to manufacture HBM chips. The plant is expected to commence operations in February this year, as per corporate registration documents.

Reports suggest that CXMT and other Chinese chip companies are engaging in meetings with semiconductor equipment manufacturers from South Korea and Japan to acquire tools necessary for HBM development. Both CXMT and XMC have received funding from local governments to drive technological development in the semiconductor sector.

Furthermore, there are indications that Huawei, the Chinese tech giant facing US sanctions, is exploring collaborations with local companies to produce HBM2 chips by 2026. This endeavor includes partnerships with companies like Fujian Jinhua Integrated Circuit.

While China’s current focus is on HBM2, the manufacturing of HBM3 chips incorporating US technology remains restricted due to export regulations. However, Chinese companies, including Huawei, are actively seeking alternatives and advancements in the semiconductor industry.

The analysis by Trendforce highlights the complexity involved in the research and manufacturing of HBM, which includes intricate processes like wafer-level packaging, testing technology, design compatibility, and more. The integration of HBM in AI processors utilizing CoWoS technology is a significant advancement in the semiconductor industry.

Overall, China’s progress in developing HBM semiconductors signifies a shift towards self-reliance in the semiconductor sector, showcasing the country’s commitment to technological advancement and innovation.

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